Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2019-07-12 23:05:12.0
SEMICON West connects the entire extended supply chain, all in one place and at one time. You’ll connect with the best in the business — from materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as flexible hybrid electronics, MEMS and sensors, and more.
Industry News | 2021-12-01 02:11:09.0
Semicon West 2021 To Gather Visionaries To Explore New Semiconductor Supply Chain Strategies And Opportunities
Industry News | 2010-08-09 12:41:05.0
Multitest’s Business Unit Manager Günther Jeserer held a successful Docking and Mounting Interface Workgroup meeting at the recent SEMICON West exhibition on Wednesday, July 14, 2010.
Industry News | 2017-06-13 20:22:20.0
Today KYZEN announced plans to exhibit at SEMICON West, in booth #6072, taking place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2008-07-24 16:21:26.0
NASHVILLE � July 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that its MICRONOX� MX2628 Aqueous Cleaner for Advanced Packaging has won the Attendee's Choice Award in the Lowest Cost of Ownership category among �Final Manufacturing� products. The award presentation took place July 16, 2008 on the show floor of the SEMICON West 2008 exhibition. Kyzen highlighted MX2628 in booth 7514 on Level 1 of the West Hall.
Industry News | 2021-11-12 04:18:41.0
KYZEN will have an exciting new product introduction at SEMICON West. The show is back as a hybrid event from Dec. 7-9, 2021. The live, in-person event will take place at the Moscone Center in San Francisco, California. A virtual environment also will be available. KYZEN's MICRONOX® MX2120 Multi-Metal Safe Power Module Cleaner will be introduced at the event in Booth #1750.
Industry News | 2009-07-14 17:50:29.0
Carlsbad, CA – July 14th, 2009: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2009 exhibition at the Moscone Center in San Francisco between 14th and 16th July at booth 743 in the South Hall.
Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
