Electronics Forum | Fri Sep 24 09:48:28 EDT 1999 | Shane
I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manufactur
Electronics Forum | Thu Aug 26 03:22:06 EDT 1999 | Jacqueline Coia
Hi There, Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have a part
Electronics Forum | Mon Aug 19 04:48:27 EDT 2002 | surachai
I'm not found this problem with adhesive but found in NC flux , Then you should get some residue and analyse it by SEM and EDX for specify the actual source ( flux or adhesive ? ) , if it 's from adhesive , sometime your supplier must join this pro
Electronics Forum | Tue Oct 26 11:22:45 EDT 1999 | Morris
I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating th
Electronics Forum | Mon Aug 19 09:42:56 EDT 2002 | blnorman
I agree with analysis. You'll never accurately find the source until you determine exactly what the "goo" is. We have this problem, but like previous posters, the goo is flux residue. We do use the ovens for both reflow and adhesive cure. The adh
Electronics Forum | Sat Sep 25 09:00:44 EDT 1999 | John
| I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manuf
Electronics Forum | Tue Aug 24 10:36:20 EDT 1999 | Chad Barnett
JUST WANDERING IF ANYONE IS PRINTING ADHESIVE ON THE BOTTOM SIDE OF BOARD WITH THROUGH HOLE COMPONENTS ALREADY PLACED. I'VE BEEN TOLD IT IS POSSIBLE BUT WANT TO LOOK INTO THIS PROCESS IN DEPTH.
Electronics Forum | Wed Dec 12 08:42:35 EST 2001 | jmathis
Hello, The problem is we are using loctite 3609 in the 300ml syringe and loctite only sells this by the case (10 cart). Our company can not use this quantity before expiration. Does anyone have any recommendations for a smt adhesive that can be pu
Electronics Forum | Tue Aug 13 16:47:22 EDT 2002 | mick
The residues are from the flux, not adhesive. Do you have flux management system in oven? You also need to check the flux type = can you use low solids. The effect is the same as steam in bathroom - it is cooling affects in exhaust and flux reforming
Electronics Forum | Wed Aug 14 03:14:39 EDT 2002 | lloyd
Thanks for the replys'. So are you saying that SMD adhesive contains a flux agent?, because at this point in the process the boards have no solder on them at all, it's all done at a solder bath after the chips have been bonded.
