Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
Electronics Forum | Sun Nov 04 11:53:19 EST 2007 | osomemac
I am looking for a mini acceleration switch for my application. It will be high volume, 1-5 million in quantity or better when in final production. It have to be really TINY and light weight. Packaging is not as critical since we do epoxy coated t
Electronics Forum | Sun Nov 04 11:55:15 EST 2007 | osomemac
I am looking for a mini acceleration switch for my application. It will be high volume, 1-5 million in quantity or better when in final production. It have to be really TINY and light weight. Packaging is not as critical since we do epoxy coated t
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-s
Used SMT Equipment | SMT Equipment
Product name: YV100XG YAMAHA multi-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XG High speed and high precision multi-function modular placement machine 0.18 seconds/CHIP ul
Industry News | 2016-02-27 22:11:00.0
GPD Global has advanced its auger pump technology with the introduction of the newly developed Precision Auger Pump. This pump was designed to offer a wide range of functionality in your process development by being compatible with a wide range of auger/cartridge assemblies.
Industry News | 2023-08-23 15:08:19.0
Next generation hardware designs are incorporating the world's fastest silicon with massive gigaflop compute power to drive data throughput.
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
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Parts & Supplies | Pick and Place/Feeders
JUKI Mounter Chain Introduction (1) JUKI Mounter towline shape like a tank chain, composed of a number of unit links, links between the rotation freely. (2) the same series of towline within the high, high, the same pitch, towline width, bending ra
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Thu Apr 16 00:00:00 EDT 2020 - Fri Apr 17 00:00:00 EDT 2020 | ,
Smart Fabrics Virtual Summit 2020
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Actively participate in the developmen
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , Texas | Human Resources,Maintenance,Management,Technical Support
Over 17 years in the training and development industry.� I have a track record of successes in designing strategic programs that address organizational skill gaps and business initiatives. Being an expert in Instructional Systems Design (ISD) I have
Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
, which accelerates fatigue failures, is therefore an important ingredient of any component-level or board-level solder joint reliability program
| https://www.smtfactory.com/Electronics-Production-with-SMT-PCB-Assembly-id68001927.html
. High-Speed Production: The automated nature of SMT Assembly machines accelerates production, reducing lead times and meeting market demands efficiently. Cost Efficiency
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