New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Rework & Repair Equipment
Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
New Equipment | Assembly Services
NextPCB has specialized in PCB Prototype and PCB Manufacturing for 15 years. In order to offer the best service and competitive price to our customers, we have PCB Prototype manufacturer and PCB Manufacturing Manufacturer dedicated to each PCB fabric
Samsung SM320 Pick and Place Machine Samsung SM320 Pick and Place Machine Chip theoretical speed ：18500CPH PCB size 510 * 460 Mounting range 0402mm Chip ~ 55mm IC Product description: Samsung SM320 Pick and Place Machine Samsung SM320 Pick
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
Samsung SM320 Pick and Place Machine Mounting range 0402mm Chip ~ 55mm IC Chip theoretical speed ：18500CPH PCB size 510 * 460mm 120ea / 112ea (docking cart) Product description: Samsung SM320 Pick and Place Machine, Mounting range 0402mm Chip
Samsung SM320 Pick and Place Machine Chip theoretical speed ：18500CPH PCB size 510 * 460 Mounting range 0402mm Chip ~ 55mm IC Feeder input: 120ea Product description: Samsung SM320 Pick and Place Machine, Chip theoretical speed ：18500CPH, PCB
