STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry News | 2010-11-04 22:57:30.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2010-12-01 13:54:27.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Technical Library | 2010-12-09 20:26:15.0
As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int
Technical Library | 2012-02-02 19:09:53.0
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S
The Foundation for Scientific and Industrial Research - SINTEF
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_mounting-hole-vias-same-name_topic2256.xml
;For example, for a hole with six reinforcing vias, the main pad is named "1", and the vias are named "2" through "7." In Altium, to use this footprint, I would have to have a schematic symbol with seven pins, and connect to each of them
| http://www.feedersupplier.com/SMT_THROUGH_HOLE
. Thus, both sides of the boards can be easily utilized for mounting, and there is no need for plated drill holes. For the purpose of connecting traces in the circuit layers, one may use vias instead, which are structurally the same as plated through-holes but much smaller
