Industry Directory | Training Provider / Events Organizer / Association / Non-Profit
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Tue May 14 13:18:33 EDT 2002 | Scott B
I think what David was getting at was, as an example. Take a cubic inch of gold. Surface area = 6 sq/in. Volume = 1 cu/in. Water displacement = X. Mass = Y Roll that cube of gold out to a micron thick. Surface area = football pitch. Volume = 1 cu/i
Electronics Forum | Tue May 14 13:19:23 EDT 2002 | stefwitt
Claude is right, however, this may work: Dip the empty board in paint and let the access paint drip off. Measure the volume of the paint before and after. Dip a populated board and measure how much more paint was required in percent. Measure the surf
Used SMT Equipment | Screen Printers
Surface Mount Techniques Semi Automatic Printer Model Number: SL-2220 Left to Right Shuttle Table Max Print Area: 21" x 23" Max PCB Size: 22" x 24" X,Y, and Theta Micro Adjust Tooling Stage Voltage: 110V - 50/60HZ Dimensions: 60" High x 65" W
Used SMT Equipment | Screen Printers
Surface Mount Techniques Semi-Automatic Printer Equipment Description SMT - Surface Mount Techniques Printer Model Number: SL-2220 Serial Number: 1878 Type: Semi-Automatic Left to Right Shuttle Table Max Frame: 29 x 31 Max Print Area: 21 x 2
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
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Parts & Supplies | Pick and Place/Feeders
0402 Ceramic Blade Nozzle (3030) – p/n 51305433 You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here&
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Parts & Supplies | Pick and Place/Feeders
0603 Ceramic Blade Nozzle 3040 51305434 We were so impressed with the new long-life ceramic 0402 nozzle (#3030) we launched earlier in 2014 that we decided to follow it up with an 0603 version! Now customers can reap the benefits of our ESD-Safe ce
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Tampa, Florida USA | Production
Reptron needs several experienced electronic manufacturing associates for its solder stations, surface mount areas, materials department, and functional test areas for 2nd and 3rd shifts. All positions require basic component recognition skills and a
Career Center | Roanoke, Virginia USA | Engineering,Management,Production
About Keltech: Keltech is an employee owned ISO certified electronics manufacturing service provider specializing in surface mount and mixed technology assemblies. Why do our employees choose Keltech for a career? What separates Keltech from other c
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Management Experience: Over 5.5 Years Managing Production, Test, Warehouse, and Process Engneering, while improving overall Quality and Efficience Project Management Experience: Managed Various Cost Reduction projects using Lean Manu
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Equipment Troubleshooting Experience: 20 Years Equipment Troubleshooting Experience Field Service Experience: Almost 4 Years Field Service Experience with Siemens EAS Customer Service Skills: Excellent Customer Service Skills wi
Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment by: Jim Hines, Adam Stanczak
GPD Global | https://www.gpd-global.com/dispenser-surface-sensing.php
Dispenser Surface Sensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
Imagineering, Inc. | https://www.pcbnet.com/blog/advantages-of-surface-mount-technology/
. This creates a stronger bond than SMT methods, but is heavier, more expensive to produce, and takes up more surface area. While through-hole mounting may be a thing of the past, through holes are still used today to transmit signals from one layer of a board to another, now referred to as plated-through holes
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
