Industry Directory | Manufacturer's Representative
Over 30 years experience in the electronics, and electrical assembly. Experienced in soldering and assembly technologies.
Industry Directory | Manufacturer
Mindready, a leading supplier of manufacturing automation and test engineering solutions, offers a comprehensive range of industrial test solutions from x-ray, in-circuit, functional and environmental testing to design, development and integration of complete test stations
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
NiProtect gloves are 4 mil, 100% nitrile ambidextrous design to provide superior tactility, puncture and abrasion resistance and available in 10" or 12" lengths. Applications: EMS Laboratory/Research Patient Examination Precision Parts Handling Proce
Electronics Forum | Mon May 20 09:24:32 EDT 2013 | davef
SAC / Ni interface is the IMC (Cu, Ni)6Sn5
Electronics Forum | Tue Aug 22 11:23:40 EDT 2000 | Dr. Ning-Cheng Lee
Plating houses seem to exhibit various results. Unacceptable Ni oxidation levels appear to be related to poor Pd plating processes. Ni oxidation can occur at 3 process stages: 1) prior to the Pd being applied (Ni already oxidized) 2) during the p
Used SMT Equipment | Flexible Mounters
Product Name: Samsung CP40L multi-function chip mounter Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP40L multi-function chip mounter Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*
Industry News | 2003-05-06 09:05:12.0
New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance
Industry News | 2022-10-24 08:01:58.0
I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that deliver high reliability. We also stand ready to work with customers in developing improved soldering materials and processes.Our objective is maximizing customer satisfaction by achieving the best possible quality and yield.
Parts & Supplies | SMT Equipment
National Instruments NI USB 6008 DAQ Cards USB Multifunction Devices Brand:IN Part Name:DAQ Cards Model:USB 6008 Material:Plastic Box Color:White
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Parts & Supplies | SMT Equipment
National Instruments NI USB 6008 DAQ Cards USB Multifunction Devices Brand:IN Part Name:DAQ Cards Model:USB 6008 Material:Plastic Box Color:White
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
E1378700000 BALL CATCH E1380715000 STICKER E13807260A0 Y AXIS SLIDER ASM E1381726000 LINEAR WAY LWL5 B E1382715000 L STICKER B E1382726000 CHUCK BASE E1383729000 BOARD BASE E1384726000 LM GUIDE RSR92M E13867000A0 HOD BOX ASM
Siemens HS60 parameters Placement head type: 12-nozzle collection and placement head Number of cantilevers: 4 Theoretical mounting rate: 60000cph Component range: 0.6mm x 0.3mm (0201) to 18.7mm x 18.7mm The highest placement accuracy (4 sigma):
Career Center | Dehradun, uterakhand India | Research and Development
• Languages: ASSEMBLY LANGUAGES (8051,8085, 8086), FUNDAMENTALS OF C • Designing Software known: MULTISIM, Project Navigator (VHDL), Mat Lab, PCB Designing, PLC & SCADA, NI VDM- 2009 and NI Lab View- 2009. Area of Interest • Embedded System • M
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/information/bpa-ni-coating-for-container
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