10 ipc-4101/126 er results

Electronic Manufacturing Service Provider

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

BGA288 19x19 mm 1.0 mm A-CABGA288- .8mm-19mm- DC Test Vehicle The test board was 2.18mm (86 mil) thick with 14 dummy inner layers. The board was constructed using FR-4 material in accordance with IPC-4101/126 with an electroless nickel/immersion gold (ENIG

Heller Industries Inc.

US0683966

GPD Global | https://www.gpd-global.com/co_website/pdf/GPD-Global-CMRT-2021.xlsx

newly published IPC-1755 Standard. Changes include: 1. Addition of new company information fields. 2. Two additional due diligence questions and removal of one. 3. Minor changes to question text throughout. 4. Expansion of instructions and definitions. 5

GPD Global