We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
Industry Directory | Manufacturer's Representative
Camtech Circuits is ISO9001:2008 and UL certificated. We strictly implement ISO9001 quality management system. Each equipment, every process has its own Manual of Engineering Instructions. No matter p
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Education/Training
If you are working with the smallest of small, surface mount components in either placement or rework of, this is the course for you. This two (2) day Advanced Surface Mount Micro Hand Soldering program focuses on the proper techniques for placement
Electronics Forum | Thu Sep 07 10:39:34 EDT 2006 | vicknesh28
Can u elaborate on the bad plating? Have u had any experience on this before? The component has 90/10 Tin lead plating
Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28
Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-free and Tin-lead Assembly
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/comprehensive-soldering/
, Through Hole and Surface Mount components. This course also covers Fine Pitch Technology and SMT soldering course. Upon successful completion of this training, you will be assured that your workforce has a good understanding of the latest industry workmanship standards, and have learned latest methods to enhance
| https://www.smtfactory.com/How-to-Choose-Insertion-Machine-for-PCB-Assembly-id48428727.html
How to Choose Insertion Machine for PCB Assembly? - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español Français Hrvatski Italiano magyar Nederlands Polski
