Industry Directory | Manufacturer
FP Stencil Sdn. Bhd. is principally involved in the manufacture and sale of laser-cut metal surface- mount technology (SMT) stencils. Our products comprise of PCB stencils, wafer stencils, mini stencils, & accessories.
Industry Directory | Manufacturer
Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.
Inline UV PCB Laser Depaneling Machine Inline UV PCB Laser Depaneling Instruction: PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Electronics Forum | Tue Feb 07 16:32:13 EST 2023 | glasscake
Good ventilation is also important to removing aerosols and other vapors. Make sure your building HVAC is pulling in a good portion of outside air. If people are complaining try to up the ratio of recirculated/outside air. This will add cost dependin
Electronics Forum | Thu Oct 19 12:34:36 EDT 2000 | lwatson
I can't seem to find an article about the limiting mass of a SMT component on the solderside of a double-sided reflowed PCB. I'm pretty sure that Phil Zarrow did an article on this subject. It went something like the mass/land surface area?
Used SMT Equipment | Pick and Place/Feeders
Placing 9,700 components per hour under optimal conditions, the user friendly Samsung CP20CVTM provides one of the highest Cost/Placement ratios in the SMT assembly equipment market. High speed of 0.37 sec/chip featuring On-the-Fly optical cente
Used SMT Equipment | Adhesive Dispensers
Standards: CE approvedLiquid ratio: 1:1-3:1 (can be adjusted) Viscosity: Mixing method: static mixer The machine has automatic mixing and automatic dispensing function. Dispensing precision is highly, speed is fast, and Position is accu
Industry News | 2016-08-03 20:48:00.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,Laurel, MD 20723, on Tuesday, August 30th.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Technical Library | 2012-10-25 16:34:02.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Inline UV PCB Laser Depaneling Machine Inline UV PCB Laser Depaneling Instruction: PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | BANGALORE, Karnataka India | Quality Control
New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud
SMTnet Express, September 28, 2017, Subscribers: 30,862, Companies: 10,741, Users: 23,873 An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios Jasbir Bath, Tony Lentz, Greg
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_stencil-aperture-design_topic1136.xml
: Stencil Aperture Design Stencil Aperture Design : Aspect ratio is one thing. Area... Author: Martijn KaandorpSubject: 1136Posted: 02 Nov 2016 at 8:24amAspect ratio is one thing
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
: I’m not exactly sure of what you mean by flux exhaustion, however; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself
