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Electronics Forum | Tue Mar 04 09:12:35 EST 2008 | davef
Q1. What would you recommend for the best practice or comparison? A1. We'd go with dip & look. It's easy and cheap, requires no advanced degrees in measurology. Have you reviewed "J-STD-002B - Solderability Tests for Component Leads, Terminations, Lu
Electronics Forum | Fri Apr 30 08:28:39 EDT 2004 | davef
Roger Saunders, President Saunders Technology, Inc wrote a fairly unbiased paper that compared different thermocouple attach methods. You can probably find it on their site. In it, about gluing thermocouples, he says: There are two general classes
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2020-02-18 14:26:44.0
Deadline extended to February 21, 2020
Technical Library | 2016-01-21 16:52:27.0
Solder paste has long been viewed as "black magic". This "black magic" can easily be dispelled through a solder paste evaluation. Unfortunately, solder paste evaluation can be a challenge for electronic assemblers. Interrupting the production schedule to perform an evaluation is usually the first hurdle. Choosing the solder paste properties to test is simple, but testing for these properties can be difficult. Special equipment or materials may be required depending upon the tests that are chosen. Once the testing is complete, how does one make the decision to choose a solder paste? Is the decision based on gut feel or hard data?This paper presents a process for evaluating solder pastes using a variety of methods. These methods are quick to run and are challenging, revealing the strengths and weaknesses of solder pastes. Methods detailed in this paper include: print volume, stencil life, response to pause, open time, tack force over time, wetting, solder balling, graping, voiding, accelerated aging, and others.
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
Silicon Valley Chapter Webinar: Electronics Reliability for Autonomous Vehicles
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMTnet Express, January 21, 2016, Subscribers: 24,035, Members: Companies: 14,931, Users: 39,786 Dispelling the Black Magic of Solder Paste Tony Lentz; FCT Assembly Solder paste has long been viewed as "black magic". This "black magic" can easily
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5027
Effects of Cl2, NO2, Rh and Temperature on Accelerated Silver and Copper Corrosion in Mixed Flowing Gas Test 中文 MEMBERS LOGIN Membership Become a Member
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High Speed High Voltage (for Automotive Applications) Microvia Design and Testing PCB/Pad Repair RF Materials Signal Integrity Solderability Surface Finishes Via Plugging and Other Protection Technical Conference Submit Technical Paper Abstract Requirements for Submission Provide an abstract of approximately 300 words that
