Novel Probing Concepts for Mass-Production Tests: Design and Challenges SMTnet Express June 15, 2012, Subscribers: 25268, Members: Companies: 8896, Users: 33235 Novel Probing Concepts for Mass-Production Tests: Design and Challenges First
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
SMTnet Express, August 1, 2018, Subscribers: 31,235, Companies: 11,006, Users: 25,050 Early Design Review of Boundary Scan in Enhancing Testability and Optimization of Test Strategy Sivakumar Vijayakumar; Keysight Technologies With complexities
