SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
SMTnet Express March 21, 2013, Subscribers: 26266, Members: Companies: 13317, Users: 34462 Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing by: C.P. Hunt, O. Thomas, D. Di Maio, E. Kamara, H. Lu; National Physical Laboratory
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder
