Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder
Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Creating Solder Joint Reliability
Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Creating Solder Joint Reliability
