Industry News: voiding (Page 5 of 58)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:24:08.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

Advances in Lead-Free Alloys, Reliability, Halogen-Free and Counterfeit Components Highlight IPC APEX EXPO 2012 Technical Conference

Industry News | 2011-12-14 15:47:27.0

Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.

Association Connecting Electronics Industries (IPC)

SMTA Intermountain Chapter to Hold Annual Technical Symposium

Industry News | 2013-09-10 12:18:26.0

The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Surface Mount Technology Association (SMTA)

Count On Tools Announces Customer Success with ezLOAD Board Support System

Industry News | 2014-01-07 18:55:28.0

Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.

Count On Tools, Inc.

Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions

Industry News | 2019-01-12 07:42:28.0

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for High Reliability Forum

Industry News | 2023-04-17 08:38:56.0

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

Improve board level reliability by reducing solder joint voiding below 10%

Industry News | 2023-11-20 13:47:24.0

MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.

MacDermid Alpha Electronics Solutions

New SN100CV solder paste from Nihon Superior at SMTAI reduces voiding

Industry News | 2018-09-18 20:11:02.0

Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

Do Solder Voids Matter - Defect of the Month

Industry News | 2019-06-16 10:14:10.0

Bob Willis Defect of the Month explains solder joint voids and are they an issue to everyone? Bobs webinar guide to voids in solder joints and how to overcome them in manufacture is available online and covers all of the different voids and solutions from his archives see https://www.bobwillis.co.uk/product/online-webinar-archive-booking/

ASKbobwillis.com


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