Industry News | 2021-01-06 17:17:19.0
The SMTA Capital Chapter is excited to host the first chapter webinar of 2021 on January20that11:00 AM EST.Fred Dimock, BTU International, will be presenting "Operation of a Vacuum Reflow Oven with Updated Void Reduction Data."
Industry News | 2012-04-12 12:39:48.0
Flexible circuit technology is utilized in all market sectors, including military, telecommunications, medical and consumer products.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2021-02-25 13:34:06.0
The best technical conference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will be recognized during show opening remarks on Tuesday, March 9.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2016-09-07 19:04:13.0
Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.
Industry News | 2012-09-17 15:38:30.0
SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …
Industry News | 2018-12-18 20:36:04.0
BTU International is pleased to announce that Fred Dimock, Manager of Process Technology, will present during the upcoming SMTA Capital Chapter Meeting. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” at the meeting, scheduled to take place Thursday, Jan. 10, 2019 from 5-7:30 p.m. at ZESTRON in Manassas, VA.
Industry News | 2019-09-21 04:28:31.0
BTU International, Inc is pleased to announce that Fred Dimock, Manager of Process Technology, will present during SMTA International. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” during the Jump Start - 101 Technical Session, scheduled to take place Tuesday, Sept. 24, 2019 from 10:30 a.m. - 4:15 p.m. in the Show Floor Theater.
