Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
Industry News | 2023-03-27 13:12:28.0
The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:
Industry News | 2023-10-23 09:48:49.0
IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Industry News | 2003-04-21 10:31:32.0
Co-sponsoring Harsh Environments Workshop
Industry News | 2008-01-23 10:59:08.0
San Jose, CA - �The International Wafer-Level Packaging Conference (IWLPC) has issued a call for papers for its fifth annual program on Oct. 13-16 at the Wyndham Hotel in San Jose.
Industry News | 2010-11-04 22:57:30.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2010-12-01 13:54:27.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2011-10-03 15:37:21.0
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International
Industry News | 2012-02-16 17:49:44.0
SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 18-20, 2012 at the Eastin Hotel in Penang, Malaysia.