Industry News | 2018-01-18 13:59:43.0
Ideal for monitoring intermittent and frequency-hopped wireless signals in real-time, these real-time devices scan a complete frequency spectrum of 9kHz to 3.2 or 6.5GHz with a maximum sample rate of 51.2MS/s.
Industry News | 2019-04-03 12:39:41.0
The new R5550 and R5750 real-time spectrum analyzers have the performance of traditional lab-grade spectrum analyzers at much lower cost, size, weight and power consumption, and can monitor wireless signals in real-time for observing intermittent and frequency-hopped signals. The R5750 version also adds GPS capabilities.
Industry News | 2019-10-26 15:15:20.0
Laserssel Co., LTD announces that it was awarded two 2019 Mexico Technology Awards in the categories of Soldering Equipment – Laser for its LSR (Laser Selective Reflow) and Bonding for its cLSR. The awards were presented to the company during a Wednesday, October 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2020-04-23 11:00:41.0
The FDA has approved the production and use of PREVENT, PVA's ventilator designed and manufactured in its Cohoes, New York headquarters to address ventilator shortages in the United States and globally due to the coronavirus pandemic.
Industry News | 2020-04-23 11:00:42.0
The FDA has approved the production and use of PREVENT, PVA's ventilator designed and manufactured in its Cohoes, New York headquarters to address ventilator shortages in the United States and globally due to the coronavirus pandemic.
Industry News | 2021-04-22 17:03:51.0
Tamper Proof and Integrated with Distributed Ledger Technology, the new Innodisk SSD Addresses Increasing Data Integrity of AI in Everyday Applications
Industry News | 2021-07-08 05:33:04.0
Laserssel Co., LTD is pleased to introduce its CLSR 6000 high-end Laser Compression Bonder for semiconductor packages. This soldering technique uses high accuracy compression tools and Area Laser bonding introduced with LSRTM(Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50 µm.
Industry News | 2021-08-13 08:27:45.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: "The Interaction of Two Solder Paste Alloys With 5 Surface Finishes"attheSMTA China South Technical Conference taking place from August 25 - 26 in Shenzhen, China.
Industry News | 2021-11-03 13:33:10.0
Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
