Industry News: sir (Page 13 of 16)

MacDermid Alpha Introduces Innovative Solder Paste Enabling Next Generation High Density Assembly Designs

Industry News | 2020-12-18 19:19:05.0

MacDermid Alpha Electronics Solutions is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components.

MacDermid Alpha Electronics Solutions

Don't Miss the APEX Presentation: Designing Reliable Electronics in Accordance with IPC J-STD-001 Rev. H Section 8 Cleanliness

Industry News | 2021-02-23 15:16:38.0

STI's Mark McMeen, VP, Engineering Services/Manufacturing, will co-present, Designing Reliable Electronics in Accordance with IPC J-STD-001 Rev.H Section 8 Cleanliness. The APEX Professional Development Course presentation will take place during the Virtual IPC APEX EXPO on Thursday, March 11, 2021 from 2-5 p.m. CST.

STI Electronics

STI's Mark McMeen to Co-Present J-STD-001 Section 8 Objective Data "Where Do I Start?"

Industry News | 2021-03-02 14:42:17.0

STI's Mark McMeen, VP, Engineering Services/Manufacturing, will co-present,J-STD-001 Section 8 Objective Data "Where Do I Start?". The APEX Professional Development Course presentation will take place during the IPC APEX Virtual EXPO on Thursday, March 11, 2021 from 9 a.m.-12 p.m., CST.

STI Electronics

MacDermid Alpha Launches New Ultra-Low Temperature Solder Paste capable of Soldering Heat-Sensitive Components

Industry News | 2021-03-12 04:52:58.0

MacDermid Alpha Electronics Solutions announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.

MacDermid Alpha Electronics Solutions

Averatek to Present "Reliability of Solder Joints on Flexible Aluminum PC Boards" at SMTAI

Industry News | 2021-10-07 15:38:24.0

Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."

Averatek Corporation

Unigen Offers In-House Conformal Coating as an Added Value to Its Manufacturing Services

Industry News | 2022-09-15 06:32:01.0

Unigen Corporation is pleased to offer cutting edge in-house conformal coating as a value-add service for customers who require additional protection and reliability for ruggedized environments.

Unigen Corporation

Gen3 and Finetech GmbH & Co.KG to Exhibit at the iPower4 Conference

Industry News | 2022-11-21 15:48:35.0

Gen3 will exhibit at the iPower4 Conference, scheduled to take place Thursday, Nov. 24, 2022 at Jubilee Conference Centre at the University of Nottingham.

Gen3 Systems

Gen3 Launches New Objective Evidence Site during APEX

Industry News | 2023-02-06 14:16:30.0

Gen3 is pleased to announce that it released its new Objective Evidence website during the 2023 IPC APEX EXPO.

Gen3 Systems

ZESTRON to Showcase Cutting-Edge Cleaning Solutions at IPC APEX EXPO 2024

Industry News | 2024-03-11 17:47:35.0

ZESTRON is excited to announce its participation in the upcoming IPC APEX EXPO 2024. The premier event for the electronics manufacturing industry will take place from April 9-11, 2024 at the Anaheim Convention Center in Anaheim, California.

3M Electrical Solutions Division

Indium Corporation Technology Experts Presenting at APEX

Industry News | 2010-04-09 21:17:21.0

Five of Indium Corporation's technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 6-9, 2010.

Indium Corporation


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