Industry News: sac305 (Page 7 of 17)

EVS International Teams up with ARK Mfg. in Arizona, New Mexico & Southern Nevada

Industry News | 2022-04-06 10:13:58.0

EVS International is pleased to announce the appointment of ARK Manufacturing Solutions, LLC as its manufacturers' representative. Dave Murrin, President and principal owner of ARK Mfg., will represent EVS' solder recover systems in Arizona, New Mexico and Southern Nevada.

EVS International

Industry Responds to FCT Solder's NC162 No Clean Liquid Flux

Industry News | 2008-10-07 18:25:16.0

GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it has recently seen an increase in sales of NC162 flux.

FCT ASSEMBLY, INC.

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Industry News | 2017-06-25 20:33:39.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Industry News | 2017-07-06 09:53:39.0

SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.

Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Industry News | 2017-07-09 20:40:11.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

Nihon Superior’s SN100C P600 D4 Paste Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:21:33.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd. announces that it has been awarded a 2009 Global Technology Award in the category of Soldering Materials for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Nihon Superior Co., Ltd.

Nihon Superior Shanghai to Exhibit at NEPCON China 2012 Implementing Lead-Free Soldering with Cost Reduction and Reliability

Industry News | 2012-03-28 15:59:44.0

Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.

Nihon Superior Co., Ltd.

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International

Industry News | 2013-09-13 13:33:38.0

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Balver Zinn


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