Industry News: moisture (Page 7 of 46)

IPC Electronics Assembly Conference in Budapest Offers Critical Information on Quality and Reliability

Industry News | 2010-08-31 12:11:44.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Electronics Assembly Quality & Reliability Conference in Budapest, Hungary on 6­–7 October, 2010.

Association Connecting Electronics Industries (IPC)

IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest Offers Critical Information

Industry News | 2010-12-03 21:35:04.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

IPC-HDBK-850 Sets Guidelines for Potting and Encapsulating Boards

Industry News | 2012-08-09 18:42:34.0

IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

Association Connecting Electronics Industries (IPC)

Gaining a Competitive Edge in Eastern Europe’s Fast-growing Electronics Assembly Market

Industry News | 2012-10-16 18:56:39.0

IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.

Association Connecting Electronics Industries (IPC)

Revolutionize Storage with Intelligent SMD Tower - I.C.T-ISS2000

Industry News | 2024-01-29 01:52:21.0

In the ever-evolving landscape of Surface Mount Technology (SMT), the I.C.T-ISS2000 stands out as a game-changer in Intelligent SMD Tower. Crafted in Europe, this cutting-edge system adheres to the highest safety standards, making it a reliable choice for safety-conscious electronics manufacturers.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

SMTAI 2009 Call For Papers Reminder

Industry News | 2009-01-23 19:18:23.0

You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.

Surface Mount Technology Association (SMTA)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO Technical Conference Papers Show Industry Leaping Out of Recession

Industry News | 2011-02-19 18:32:03.0

From a record number of technical abstract submissions, the best papers in PCB and electronics manufacturing and assembly were selected for presentation at the IPC APEX EXPO™ Technical Conference, April 12–14, 2011 in Las Vegas. Featuring new research and innovations from industry experts around the world, the IPC APEX EXPO Technical Conference will cover more than 30 technical topics to provide the industry with practical solutions and new opportunities for the future.

Association Connecting Electronics Industries (IPC)


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