Industry News: inkjet (Page 3 of 3)

Origami Electronics at Printed Electronics USA

Industry News | 2012-12-04 14:08:23.0

On Dec 5-6, attendees to the Printed Electronics USA conference and exhibition in Santa Clara, CA, will receive their own origami printed electronic device. One of the compelling benefits of printed electronics is that electronics can be used in completely new and innovative form factors.

IDTechEx, Inc.

Heraeus Electronics to introduce new advanced solutions to further elevate device performance at SEMICON China 2023

Industry News | 2023-07-03 19:52:11.0

Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.

Heraeus

IMAPS Announces Keynote Speakers for IMAPS 2010.

Industry News | 2010-06-23 13:52:01.0

IMAPS is proud to announce two world-renowned industry leaders as Keynote Speakers at the 43rd International Symposium on Microelectronics (IMAPS 2010, November 2-4, 2010, Raleigh Convention Center, Raleigh, NC.

International Microelectronics Assembly and Packaging Society (IMAPS)

Weiner International Associates’ Dr. Dietz Completes Tutorial Suite

Industry News | 2011-04-04 15:48:55.0

Executive Associate Dr. Karl H. Dietz, of Weiner International Associates has completed preparation of the tutorial "HDI, Fine Line Processing." This is the capstone of his new suite of tutorials and seminars for bare board and substrate fabrication.

Weiner International Associates

IDTechEx launches online Market Intelligence Portal

Industry News | 2013-05-23 22:15:30.0

IDTechEx has recently launched an online browser-based Market Intelligence Portal (www.IDTechEx.com/portal ), bringing you in-depth market intelligence and independent analysis throughout the year.

IDTechEx, Inc.

ASYS Group unveils new Printer Platform and new technologies at IPC APEX

Industry News | 2014-02-14 22:45:00.0

ASYS Group is proud to announce the all new SERIO 4000 Printer Platform from EKRA, as well as the revolutionary PULSE Mobile Line Assistant interface for ASYS Handling and Process machines.

ASYS Group

OLED vs LED Lighting

Industry News | 2012-10-30 21:59:40.0

The latest devolopments in the OLED lighting space will be one of the major topics at the forthcoming Printed Electronics USA 2012 conference & exhibition (www.printedelectronicsusa.com). The event, being held on December 5-6 in the heart of silicon valley at Santa Clara, CA, USA, focuses on the commercialization of the technology, covering broadly organic, inorganic, thin film and flexible nanotechnologies.

IDTechEx, Inc.

World's first flexible multi-functional timer to be distributed at Printed Electronics Europe

Industry News | 2014-03-24 13:39:01.0

A consortium of partners will launch the world's first flexible timer based on printed electronics at the IDTechEx Printed Electronics Europe event in Berlin, April 1-2. The device consists of an electronic logic circuit implemented with thin film metal oxide transistors, powered by a printed battery, and integrated onto a paper substrate. It has four timing sequences and is designed for multi-functional use across four different applications.

IDTechEx, Inc.

Orbotech’s SPTS Technologies Accelerates Industry Adoption of its Mosaic Plasma Dicing Solution with Order from JCAP Corporation

Industry News | 2017-03-08 19:49:16.0

ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.

Orbotech

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Industry News | 2018-10-18 11:18:14.0

Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design

Flason Electronic Co.,limited

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