Industry News: fine-pitch (Page 10 of 60)

Smart Sonic Introduces New Automatic Stencil Cleaner

Industry News | 2001-05-21 13:24:29.0

Uses less chemistry, generates less wastewater and cleans solder paste, adhesives and flux residue in one system!

Smart Sonic Stencil Cleaning Systems

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Industry News | 2007-11-08 21:34:39.0

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

i3 Electronics

ESSEMTEC to Feature SP200-AV at APEX 2008

Industry News | 2008-03-20 15:46:19.0

Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

DEK launches new stencil solution for ultra fine-pitch printing

Industry News | 2009-03-02 00:28:54.0

DEK has announced the launch of its VectorGuard� Platinum stencil technology. Now available for DEK customers in Asia, Europe and the Americas, the new technology provides semiconductor manufacturers with an ideal solution for a diverse range of next-generation challenges.

ASM Assembly Systems (DEK)

Europlacer Receives Order for Xpress Placement System

Industry News | 2009-04-27 17:58:40.0

DORSET, UNITED KINGDOM - April 2009 - Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that CT Production placed an order for the Xpress placement system.

EUROPLACER

Zurvahn LLC Appoints John H. Buckley as Senior Vice President of Sales

Industry News | 2009-05-13 21:48:50.0

COCONUT CREEK, FL � May 2009 � Zurvahn LLC, a leading supply chain management expert, announces the appointment of John H. Buckley as its Senior Vice President of Sales.

Zurvahn LLC

BPM Announces the Retirement of Lyman Brown, William White to Assume CEO Position

Industry News | 2010-01-28 11:44:36.0

HOUSTON — January 21, 2010 — BPM Microsystems announces the retirement of Lyman Brown, executive vice president and chief operating officer, effective January 31, 2010. William White will transition back into the role of president and chief executive officer.

BPM Microsystems, Inc.

ECT to Showcase Fixturing Solutions at the Del Mar Show

Industry News | 2012-04-02 13:06:06.0

Everett Charles Technologies’ (ECT) announces that its Contact Solutions Group (CSG), Compliant Connector Group (CCG) and Fixture Services Group (FSG) will showcase the company’s latest products

Everett Charles Technologies

Hesse & Knipps, Inc. Appoints New Technical Training Manager

Industry News | 2012-07-25 10:06:43.0

Hesse & Knipps, Inc.,has appointed Allan Camp as Technical Training Manager.

Hesse Mechatronics


fine-pitch searches for Companies, Equipment, Machines, Suppliers & Information

IPC Training & Certification - Blackfox

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

Training online, at your facility, or at one of our worldwide training centers"
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications
Pillarhouse USA for Selective Soldering Needs

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
SMT spare parts

"Heller Korea"