Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2024-03-18 13:22:09.0
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Industry News | 2007-10-06 12:23:13.0
SMT Forum 2008
Industry News | 2009-04-09 23:00:29.0
2009 will be an interesting and exciting year for us at Etek Europe Ltd. Although our customers in the UK & Central & Eastern Europe have experienced a slow down in the last few months, we are still finding opportunities out there.
Industry News | 2015-10-26 18:54:52.0
VJ Electronix has introduced a new and improved Micra Rework System for mobile and small format boards.
Industry News | 2011-03-10 21:20:06.0
Juki Corporation will showcase its latest assembly systems in Booth #1559 at the upcoming IPC APEX EXPO.
Industry News | 2008-08-11 23:49:45.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit PMT400 Rework System in booth 825 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
Industry News | 2009-09-26 16:57:04.0
OK International has launched its new MRS-1000 Modular Rework System. A convection rework system for the removal and placement of BGA/CSP and SMT components, the Modular Rework System integrates state-of-the-art assembly technologies to widen application possibilities and enhance productivity going forward.
