Industry News: copper substrate (Page 4 of 13)

Great Success at DesignCon

Industry News | 2016-02-01 03:04:39.0

Hampoo Showcases its' one-stop PCB Solution.

Hampoo Science & Technology Co., Ltd

MacDermid Alpha Releases CircuEtch 200 Anisotropic Final Etch for SAP and mSAP

Industry News | 2020-11-03 13:18:05.0

MacDermid Alpha Electronics Solutions announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.

MacDermid Alpha Electronics Solutions

KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024

Industry News | 2024-05-20 10:37:16.0

KYZEN is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX® MX2123 Multi-Process Power Module Cleaner.

KYZEN Corporation

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

Heraeus Electronics Exhibits at PCIM Europe May 10-12th

Industry News | 2022-04-13 10:29:39.0

Heraeus Electronics today announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.

Heraeus

Molex Copper Flex Products Invests in AOT

Industry News | 2006-11-09 12:31:53.0

NOVEMBER 9, 2006

Lloyd Doyle

MacDermid Alpha to Exhibit and Present at TPCA and IMPACT

Industry News | 2021-12-13 12:52:59.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.

MacDermid Alpha Electronics Solutions

Nihon Superior Introduces Improved Flux-Cored Solder Wire

Industry News | 2018-09-11 19:30:04.0

Nihon Superior Co.has developed a new flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The new cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.

Nihon Superior Co., Ltd.

NEO Tech to Focus on Space-Qualified Capabilities during Space Tech Expo 2019

Industry News | 2019-05-15 17:09:30.0

NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.

NEO Technology Solutions (NEO Tech)

Achieve Optimal Uniformity with BTU's TrueFlat Technology at SEMICON Taiwan

Industry News | 2023-09-04 14:03:03.0

BTU International, Inc. will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.

BTU International


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