Industry News | 2019-10-18 10:43:36.0
Techcon has announced plans to exhibit in Booth #545 at The ASSEMBLY Show, scheduled to take place Oct. 22-24, 2019, at the Donald E. Stephens Convention Center in Rosemont, IL. The company will showcase its TSR2000 Smart Dispensing Robots, the TS8100 Series Progressive Cavity Pump, and preview the new TS9800 Jet Valve Dispensing System.
Industry News | 2019-11-04 15:52:59.0
Techcon plans to exhibit in Hall A2, Booth 135 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. The company will showcase its new TS9800 Series Jet Valve Dispensing System, TS8100 Series Progressive Cavity Pump and TSR2000 Smart Dispensing Robots.
Industry News | 2020-06-11 06:23:00.0
Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
Industry News | 2021-12-21 14:53:11.0
PVA today announced plans to exhibit at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The team will showcase four systems in Booth #2301, including the Delta 8 Selective Conformal Coating Machine with the new Valve Tool Changer and 5th Axis Motorized Tilt. Additionally, a Delta 8 Coating/Dispensing System will be equipped with a PDP Progressive Cavity Dual Pump with Fiducial Camera and Needle Calibration, another Delta 8 Coating/Dispensing System will be on display with the MR1 Metered Piston Dispenser, and the Sigma Benchtop Robot will be shown with the FCS300 Spray Valve and FCM100 Front Closing Micro Dispense Valve.
Industry News | 2024-03-04 11:38:36.0
PVA is excited to announce its participation in productronica China 2024, one of the leading trade fairs for electronics development and production, scheduled to take place from March 20-22, 2024, at the Shanghai New International Expo Center (SNIEC). PVA will be exhibiting alongside its distributor, FOCI, in Hall E6, Booth #6746, where attendees can experience firsthand the latest advancements in conformal coating and dispensing technology.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2011-03-29 11:05:11.0
Fluid Research Corporation is pleased to announce the TRITON HD1033, a two component meter, mix and dispensing system designed to expertly manage thermoset polyurethanes for use in encapsulating, potting and molding of wire harnesses, electrical connector terminations, cables, printed circuitry and other electrical components.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
