Industry News | 2009-03-10 15:56:35.0
San Diego � January 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will introduce Reflow Process Inspection (RPI) in booth 2258 at the APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2009-04-08 19:05:40.0
San Diego � March 2009 � KIC announces that it has been awarded a NPI Award in the category of Process Control Tools for its RPI in-line inspection system. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Industry News | 2009-05-13 21:01:07.0
San Diego � May 2009 � KIC announces that it has been awarded the 2009 EMAsia Innovation Award in the category of Process Control Software for its RPI in-line inspection system. The award was presented to the company during an April 22, 2009 ceremony that took place at the Shanghai Everbright International Hotel during Nepcon China 2009.
Industry News | 2009-09-17 14:57:44.0
San Diego — September 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will feature Reflow Process Inspection (RPI) in booth 830 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2016-04-27 16:18:18.0
ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.
Industry News | 2016-05-18 09:46:48.0
ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.
Industry News | 2016-06-22 15:41:21.0
Visit YINCAE Booth 6448
Industry News | 2016-07-26 16:59:00.0
SMTA International is 2 months away!
