Industry News | 2008-05-23 18:09:23.0
LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).
Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2014-02-21 11:40:56.0
Metcal today announced that Paul Wood will present “Rework Challenges for Smart Phone & Tablets: Do it Right the First Time” during the Rework technical session at IPC APEX EXPO on Wednesday, March 26, 2014 from 1:30-3 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.
Industry News | 2014-02-24 15:36:41.0
Metcal today announced the venue for the fifth stop on the 2014 rework tour.
Industry News | 2014-03-19 11:12:48.0
Metcal today announced the venue for the next stop on its 2014 rework tour.
Industry News | 2014-03-19 11:13:12.0
Metcal today announced the venue for the next stop on its 2014 rework tour.
Industry News | 2014-03-24 13:53:04.0
Metcal today announced the venue for the next two stops on its 2014 rework tour.
Industry News | 2014-04-08 09:39:42.0
Metcal today announced the venues for the next two stops on its 2014 rework tour.
Industry News | 2014-09-06 18:07:02.0
Metcal today announced that it will hold its next rework workshop in conjunction with Kester Solder.
