Industry News | 2023-11-20 13:47:24.0
MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.
Industry News | 2018-04-27 09:59:45.0
Data I/O Corporation announces that it received a 2018 SMT China Vision Award in the category of Programming for its UFS device programming support for automotive applications on the LumenX™ programming platform. The award was presented to the company during an April 24, 2018 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2019-05-12 19:13:21.0
SHENMAO America, Inc. offers PF719 Thermal Fatigue Resistance Pb-Free Solder Alloy. PF719 provides excellent thermal fatigue reliability. The alloy offers a similar operating temperature window to typical SAC alloys.
Industry News | 2018-04-27 10:10:49.0
Data I/O Corporation announces that it has been awarded a 2018 EM Asia Innovation Award in the category of Programming for its UFS device programming support for automotive applications on the LumenX™ programming platform. The award was presented to the company during an April 25, 2018 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2011-02-24 21:33:45.0
JEDEC Solid State Technology Association today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.
Industry News | 2023-10-30 12:14:11.0
Altus Group is enabling manufacturers to adopt advanced semiconductor packaging techniques with Koh Young's Meister D automated optical inspection (AOI) systems.
Industry News | 2009-09-17 15:03:07.0
RENTON, WA, September 2009 — Microscan, a global technology leader for precision data acquisition and control solutions, introduces the new point-and-shoot Mobile Hawk handheld imager that quickly reads any 2D barcode, including direct part marks (DPM).
Industry News | 2011-01-05 17:46:58.0
Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.
Industry News | 2014-01-24 15:31:06.0
Since the Compact Flash Association released the specification of CFast 2.0, Apacer has invested actively in R&D and taken the lead to roll out the first CFast 2.0 memory card - CFast 2, around the globe with SATA 3.0 (6Gb/s) high-speed transmission interface.
Industry News | 2019-11-28 22:16:03.0
Climatest will also launch new products one after another during 2019-2020
