Industry News | 2023-07-22 04:00:18.0
Embrace flexibility in LED lighting manufacturing with our advanced SMT Production Line. Experience seamless integration and precision in assembling flexible LED lighting solutions with our state-of-the-art equipment. Elevate your production capabilities and deliver innovative and adaptable LED lighting products to the market with our cutting-edge SMT solutions.
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2021-08-26 11:08:40.0
Averatek is pleased to announce that Absolute EMS has implemented soldering to aluminum using Averatek's Mina™ chemistry. Absolute EMS assembles surface mount components onto polymer substrates with aluminum traces using Averatek's Mina™ pretreatment.
Industry News | 2010-03-24 13:26:24.0
NASHVILLE — March 2010 — Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will highlight METALNOX® M6060 and METALNOX® M6310 in Hall 4, Booth 4513 at the upcoming PaintExpo, scheduled to take place April 13-16, 2010 at the Karlsruhe Exhibition Centre in Karlsruhe, Germany.
Industry News | 2010-07-29 14:23:35.0
Christopher Associates announces that a Bay area thin film photovoltaic manufacturing company recently adopted the Japan Unix ‘Unisonik’ soldering system for its large panel soldering needs.
Industry News | 2021-05-21 12:12:03.0
Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2019-05-15 17:09:30.0
NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
