Industry News: aluminum boards (Page 9 of 13)

Join Japan Unix at the IPC APEX EXPO for New Laser Soldering Solutions

Industry News | 2016-02-15 20:15:10.0

Japan Unix will exhibit in Booth #3010 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will showcase desktop soldering robot, laser and ultrasonic soldering solutions. Products on display will include:

Japan Unix Co., Ltd.

STI Acquires Fischerscope X-ray XDAL 237

Industry News | 2017-07-19 21:09:38.0

STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.

STI Electronics

AMERICAREP to Represent Super PCB at the Del Mar Electronics Show

Industry News | 2019-04-15 07:04:43.0

Super PCB today announced that AMERICAREP will represent the company at the Del Mar Electronics & Manufacturing Show, scheduled to take place May 1-2, 2019 at the Del Mar Fairgrounds in San Diego, CA.

Super PCB

Horizon Sales to Represent Super PCB at the SMTA Wisconsin Expo

Industry News | 2019-04-24 19:24:16.0

Super PCB today announced that Horizon Sales will represent the company at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 7, 2019 at the Milwaukee Airport Crowne Plaza in Wisconsin.

Super PCB

New Yorker Electronics releases ASC Oil & Gel Filled Metallized Polypropylene Capacitors

Industry News | 2021-06-28 14:15:15.0

ASC Capacitors' X382 3-Phase Capacitors are designed for Long Life and Low Dielectric Losses

New Yorker Electronics

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing

Industry News | 2016-09-21 15:33:30.0

Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.

MARCH Products | Nordson Electronics Solutions

New Yorker Electronics Supplying CDE Custom Pulse Capacitors

Industry News | 2021-01-05 10:42:48.0

New Cornell Dubilier Electronics Custom Power Capacitors are used for Flash Lamps, Lasers and Pulse Forming Networks

New Yorker Electronics

High-Capacitance, Low Profile Metallized Polypropylene Film Capacitor Released by New Yorker Electronics

Industry News | 2021-05-11 15:06:26.0

New CDE-Illinois DC Link Capacitor Series Offers Low-Profile Mounting in a High-Capacitance, High-Voltage Film Capacitor

New Yorker Electronics

Vishay Intertechnology Thermawick DMD Thermal Jumper Chip Removes Heat from Electrically Isolated Components

Industry News | 2021-05-21 12:12:03.0

Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life

New Yorker Electronics


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