Technical Library | 1999-05-06 12:11:42.0
The newest workstations and servers, targeting computationally-intensive applications and large-scale database management, use 64-bit microprocessors and provide the next generation of computing power.
Technical Library | 2007-06-13 13:44:10.0
Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The electrical advantages offered by the use of a thin PTFE composite substrate were coupled with intrinsic mechanical advantages to create very high performance applications. The application development required interactions of design, fabrication, and new manufacturing technology to obtain rapid prototype production and allow a successful ensuing manufacturing ramp.
Technical Library | 2007-10-02 22:09:50.0
The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share of the electronics market driven by Department of Defense (DoD) applications has created a niche market for RF qualified devices. The DoD, with its emphasis on COTS (Commercial Off The Shelf) and "Open" systems, is beginning to become more interested in using commercially oriented RF devices for military applications as a means to leverage the volumes and innovations of the commercial world.
Technical Library | 1999-05-07 10:20:34.0
Media (video, audio, graphics, communication) applications present a unique opportunity for performance boost via use of Single Instruction Multiple Data (SIMD) techniques. While several of the computeintensive parts of media applications benefit from SIMD techniques, a significant portion of the code still is best suited for general purpose instruction set architectures. MMX™ technology extends the Intel Architecture (IA), the industry's leading general purpose processor architecture, to provide the benefits of SIMD for media applications.
Technical Library | 2006-09-06 15:25:43.0
Transition to lead free solder stations in electronics packaging has raised issues regarding process, metallurgy and reliability m assemblies. In regards to soldering, lead has been used for thousands of years in a wide range of applications. Conventional eutectic or near eutectic tin-lead solder compositions have been used for virtually all soldering applications in electronics assembly for the last 50 years, In the electronics assembly process, a majority of commercial rework applications and some low density board assembly processes require hand soldering stations (...) This paper describes an attempt to quantify both qualitative and quantitative data that can aid in the evaluation of lead free soldering irons.
Technical Library | 2018-08-16 12:18:23.0
Appliance designers are constantly evolving to satisfy the ever changing wants and needs of their consumer base. These changes filter down and include not only the materials but also the equipment used to dispense the material in the manufacturing processes. Moreover, the latest evolution of appliances also seeks to add luxury controls and eye-catching applications. This challenge then, of new applications and material dispensing, often means the application and execution of these increasingly complex materials present multiple challenges up and down the appliance supply chain. Successfully meeting the material dispensing challenge has the potential to spur growth significantly in the higher-end appliance industry as the manufacturing adhesion processes evolve to meet market demand.
Technical Library | 2021-09-08 14:03:55.0
There is need in the industry to understand the effects of silver presence in solders from various applications perspective. This article will attempt to present a review of the key published results on the silver containing alloys along with results of our internal studies on wave soldering, surface mount and BGA/CSP applications. Advantages and disadvantages of silver at different levels will be discussed. Specifically this report will focus on the effect of silver on process conditions, drop shock resistance, solder joint survivability in high strain rate situations, thermal fatigue resistance, Cu dissolution and effects of silver in combination with other alloy additives. Specific application problems demanding high silver level and other requiring silver level to the minimum will be discussed.
Technical Library | 1999-05-06 15:14:48.0
To help the designer set the appropriate current level, AMP has developed a new method of specifying current-carrying capacity. This new method takes into account the various application factors that influence current rating.
Technical Library | 2010-08-26 20:43:08.0
Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some of the challenges that may be encountered when implementing an RFID system
Technical Library | 2011-07-14 17:47:11.0
In this paper, the concept for the next generation of resist stripper solutions is introduced, with specific emphasis upon development of new solutions targeted at the ever demanding fine line applications. The novel formulation used minimises the initial
