Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
. Thus, behaviors of Cu pillar packages during Accelerated Thermal Cycling (ATC) were examined. Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=16
:00PM Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling Webinar Douglas Philbrick
| https://pcbasupplies.com/alloy-solder-paste-enig/
. That helps to prevent propagation of crack at the solder joint in thermal cycling. As found below, SB6NX shows much higher sheer strength than SAC305 with ENIG and OSP substrate alike
| http://etasmt.com/te_news_industry/2013-03-23/3361.chtml
. For prototyping, "dead bug" breadboarding can be used. SMDs' solder connections may be damaged by potting compounds going through thermal cycling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/121917-new-dispensing-technology-released-by-nordson-efd-in-2017
. The material resists degradation caused by thermal cycling, making it suitable for a wide range of electronics applications. Find out how to select the right formulation for your application with this useful Thermal Compound Selection Guide
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Research finds better creep resistance and improved fatigue resistance during thermal cycling. Voiding within the solder joint is a concern on electronics used for automotive, power electronics, LED, electrical conductivity and thermal dissipation performance
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 28-4 Assessment of the Effect Of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure Pradeep Lall, Ph.D., and Kazi Mirza Abstract 28-3 Non-destructive Evaluation of Solder Ball Quality under
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
. They expand less during thermal cycling, making them ideal for higher layer counts. Polyimide laminates are slightly more expensive than FR-4 laminates. Teflon
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/courses.cfm
. The harsh environment simulates the thermal load including frost cycling to induce low dewing point conditions through cyclic temperature changes at high humidity
