ORION Industries | http://orionindustries.com/pdfs/kapton.pdf
) for electrical properties, under their file number E39505 for Kapton® polyimide film. Properties of Type FN Film Heat Seal Strength Film-to-Film Seals The peel strength of heat seals between the coated and uncoated sides of one-side coated Kapton®
GPD Global | https://www.gpd-global.com/co_website/peelforcetester.php
) SPC software package. Measures peel force strength of cover tape on SMT component carrier packaging. Correct peel force strength provides compatibility with SMT Pick & Place systems
GPD Global | https://www.gpd-global.com/peelforcetester.php?utm_source=dsapril2017&utm_campaign=newsletter&utm_medium=text
) SPC software package. Measures peel force strength of cover tape on SMT component carrier packaging. Correct peel force strength provides compatibility with SMT Pick & Place systems
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_09_16_09.pdf
Cracking or delamination during reflow tends to be an overstress mechanism and can therefore be described as a stress vs. strength phenomenon
GPD Global | https://www.gpd-global.com/peel-back-force-tester.php?utm_source=dsapril2017&utm_campaign=newsletter&utm_medium=text
) SPC software package. Measures peel force strength of cover tape on SMT component carrier packaging. Correct peel force strength provides compatibility with SMT Pick & Place systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-announces-the-introduction-of-a-new-method-for-testing-thin-die
Announces the Introduction of a New Method for Testing Thin Die 2014-12-10 Nordson DAGE a division of Nordson Corporation (NASDAQ: NDSN) continue to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-white-paper-plasma-clean-to-reduce-wire-bond-failures-now-available
. Decreases in bonded area, average shear strength, and pull strength are all indicators that when the bond is made, the area of contact between the bond wire and the pad will be sub-optimal
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/bondtesters?con=t&page=6
Support Suppliers Resources Careers Home Product Type Bondtesters Contact Us Bondtesters Find ball shear and wafer bond strength test equipment at Nordson Bond strength testers help electronics
ORION Industries | http://orionindustries.com/pdfs/lexanfr60.pdf
% 0.28 MECHANICAL Tensile Strength ASTM D882 psi @ Yield 10,000 Ultimate 8,800 Tensile Modulus ASTM D882 psi 320,000 Elongation ASTM D882 % 25
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=4
& inspection Solutions for SMT Manufacture Nordson DAGE Stud pull Nordson DAGE The stud-pull test measures the bond strength of dies and other flat components to the substrate
