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Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Process and design-related causes Process and design-related causes
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I.C.T-4034 | PCB Printer Solder Paste Support Frameless Stencil Printer from China manufacturer - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
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Modular Design PCB Reflow Oven A800-SMT Reflow Oven-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T
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from the solder before it solidifies. Process and design-related causes: • Improper solder volume due to improper land design • Improper solder volume due to blocked stencil aperture
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. Process and design-related causes: • Improper solder volume due to improper land design • Improper solder volume due to blocked stencil aperture
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? What I want is maximum control over all the shapes in every layer, including the recommended Bow Tie aperture in the IPC-7525A Stencil Design Guidelines
