Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
– Tin Silver Vs. Tin Silver Copper Antimony • With .5% Antimony – Cold temperature stability is enhanced – Reduced Copper intermetallics
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
– Tin Silver Vs. Tin Silver Copper Antimony • With .5% Antimony – Cold temperature stability is enhanced – Reduced Copper intermetallics
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. 52In-48Sn has likewise been used as "lead-free" solder material in SMT applications. In-Sn is eutectic at 50.9In49.1Sn. In-Sn solder exhibits a substantially lower melting temperature. Tin-silver-copper
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/3-things-you-should-know-about-lead-free-soldering/
forces the electronics industry to look for safer alternatives, like lead-free solder. Lead-free solder can include various chemical elements such as tin, copper, zinc, manganese, silver, or gold, but the most commonly used is tin, silver, and copper, often abbreviated as SAC, derived
Blackfox Training Institute, LLC | https://www.blackfox.com/3-things-you-should-know-about-lead-free-soldering/
forces the electronics industry to look for safer alternatives, like lead-free solder. Lead-free solder can include various chemical elements such as tin, copper, zinc, manganese, silver, or gold, but the most commonly used is tin, silver, and copper, often abbreviated as SAC, derived
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. 52In-48Sn has likewise been used as "lead-free" solder material in SMT applications. In-Sn is eutectic at 50.9In49.1Sn. In-Sn solder exhibits a substantially lower melting temperature. Tin-silver-copper
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. 52In-48Sn has likewise been used as "lead-free" solder material in SMT applications. In-Sn is eutectic at 50.9In49.1Sn. In-Sn solder exhibits a substantially lower melting temperature. Tin-silver-copper
| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
by Nihon Superior Sha Co., Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper-nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements
