Partner Websites: osp thermal cycle bga (Page 2 of 5)

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Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

+125 Thermal Cycle Test Results" 2009: Paul Vianco, Ph.D., Sandia National Laboratories "Pb-Free Solder and Beyond - Trends and Challenges

Surface Mount Technology Association (SMTA)

Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb or In

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454

:  Sn-Ag-Cu (SAC) solders generally have better thermal cycling performance than eutectic Sn-Pb. However, their performance deteriorates significantly as the harshness of the thermal cycle increases, and the high-Ag SAC solders that perform best in thermal cycling have relatively poor drop impact properties

Surface Mount Technology Association (SMTA)

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. Thermal cycle life of the BGA components can change Build test vehicle and run thermal cycle testing Larger and heavier assemblies Shock/vibration differences Test final assemblies using shock/vibration/HALT PTH rework time is longer Cu dissolution can

Surface Mount Technology Association (SMTA)

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GPD Global | https://www.gpd-global.com/loader-unloader-max.php

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