| https://unisoft-cim.com/solder.php
PCB Selective Soldering Machine Programming Software ( flux / solder files) Thru-hole THD | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
| http://etasmt.com/te_news_bulletin/2021-08-31/23761.chtml
4.1 flux management system From: Author: Publish time:2021-08-31 18:53 Clicks:7 The Generation 4.1 flux management system has been developed for machines equipped to run with an inert atmosphere and is the latest evolution of I.C.T Industries
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23761.chtml
4.1 flux management system From: Author: Publish time:2021-08-31 18:53 Clicks:9 The Generation 4.1 flux management system has been developed for machines equipped to run with an inert atmosphere and is the latest evolution of I.C.T Industries
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/news/new-xqr41v-needle-valve-from-nordson-efd-is-next-generation-dispensing-technology-4-3-18
% smaller size and the QR clasp, which reduces downtime for maintenance to less than two minutes , the xQR41V is the next generation of precision dispensing technology
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-glossary
(H 2 O). One Kelvin is the same change in temperature as one Centigrade. L M N O Outgassing Trapped gas that is released from a solid when it is heated or placed in a vacuum
| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
: Air bubbles or voids are in all the solder joints ever made, in one form or another. At times they are filled with flux or soldering tinning fluids and other times they are caused by outgassing and they are simply a void with nothing in them
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: Air bubbles or voids are in all the solder joints ever made, in one form or another. At times they are filled with flux or soldering tinning fluids and other times they are caused by outgassing and they are simply a void with nothing in them
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
). F Fillet Solder formation at the intersection of surfaces of a solder connection. Fine Pitch Centerline spacing of leads 0.5 mm (20 mils) or less. Flux A material that cleans metal surfaces of absorbed gases, oxide films, and other surface contaminants
