Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
| https://www.eptac.com/webinars/boards-get-the-bare-facts-on-bare-boards/
covering design, fabrication and inspection. We take a look at IPC-A-600, IPC-6012 and other standards that can be crucial to support your efforts from start to finish in the fabrication process of the most critical component in your assembly
| https://www.eptac.com/webinars/boards-get-the-bare-facts-on-bare-boards
. We take a look at IPC-A-600, IPC-6012 and other standards that can be crucial to support your efforts from start to finish in the fabrication process of the most critical component in your assembly
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
. Copper weights range from 1 to 4g. Finish plating can be leaded solder, or any following RoHS-compliant finishes: lead-free solder, immersion gold, immersion silver, white tin, or OSP
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-find-the-best-pcb-manufacturer-for-large-scale-production/
. The first step towards achieving this will be to have a “smart platform” or a software-based platform. A good software platform allows the manufacturer to control the whole process efficiently, from start to finish. 2. Quantity Levels
| https://www.eptac.com/faqs/ask-helena-leo/page/8
... Read More J-STD-001E-2010: 4.5.1, Gold Removal Issues QUESTION Question: Since we are seeing more and more components with gold finish on the solder attachment pads
Imagineering, Inc. | https://www.pcbnet.com/blog/imagineering-sponsors-collegiate-solar-car-project-destined-for-american-solar-challenge-2018/
what’s possible for the future of the auto industry, rather than just cross the finish line. In July, SolarPack will head to Hastings, Nebraska for the Formula Sun Grand Prix to qualify for the official Solar Challenge
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
: Rockwell Collins Date Published : 10/14/2018 Conference : SMTA International Abstract: The 2005 Restriction of Hazardous Substances (RoHS
