5 dewetting intermetallics results

Intermetallic Growth on PCB - Heller

Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth

– Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component

Heller Industries Inc.

•  In Sn-rich solders on a Cu substrate, Cu6Sn5 (η) or Cu3Sn (ε) intermetallic layers are formed at the solder/substrate interface 6 Adapted by Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

What Are Reflow Soldering Defects - Heller

Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/

Intermetallics Appearance Component Cracking Bridging Grainy Solder Laminate Discoloration Leaching Halo Effect Discolored Joint help@hellerindustries.com 1-800-394-OVEN 1-800-394-OVEN Company About News Events Careers Heller Blog Certifications Equipment Convection Reflow Ovens New

Heller Industries Inc.

PCB Delamination

Heller Industries Inc. | https://hellerindustries.com/delamination/

. (Some practitioners pre-bake components and boards to drive out moisture. This is not encouraged and should be a last resort as baking tends to build intermetallics as well as degrade the solderability by increasing oxidation levels

Heller Industries Inc.