122 area reduction results

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf

 Vacuum-assisted reflow with convection heating utilizes continuous operation thermal profiles for low COO and high UPH.  Recent customer installation showed 10X reduction in voids, meeting specification of <1% total void area

Heller Industries Inc.

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf

 Vacuum-assisted reflow with convection heating utilizes continuous operation thermal profiles for low COO and high UPH.  Recent customer installation showed 10X reduction in voids, meeting specification of <1% total void area

Heller Industries Inc.

Key Advances in Void Reduction-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23577.chtml

%. Another key area to be discussed is the maximizing of the unit per hour (UPH) ofthe system while still achieving the void rate reduction < 1

Key Advances in Void Reduction-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23577.chtml

%. Another key area to be discussed is the maximizing of the unit per hour (UPH) ofthe system while still achieving the void rate reduction < 1

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. The Weibull plot illustrates the influence of planar microvoiding on thermal fatigue reliability. The imbedded planar or flat section photomicrographs show the reduction in solder joint attachment area caused by planar voiding

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

. The Weibull plot illustrates the influence of planar microvoiding on thermal fatigue reliability. The imbedded planar or flat section photomicrographs show the reduction in solder joint attachment area caused by planar voiding

Heller Industries Inc.

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf

. The Weibull plot illustrates the influence of planar microvoiding on thermal fatigue reliability. The imbedded planar or flat section photomicrographs show the reduction in solder joint attachment area caused by planar voiding

Heller Industries Inc.

. n Recent customer demonstration showed 10X reduction in voids, meeting spec of <1% total void area n Reflow time under vacuum of 15 seconds was able to achieve <1

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf

Heller Industries Inc.

46969

. n Recent customer demonstration showed 10X reduction in voids, meeting spec of <1% total void area n Reflow time under vacuum of 15 seconds was able to achieve <1

46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf

Heller Industries Inc.

46969

% reduction of the minimum annular at the measurement area due to defects such as pits, dents, nicks, pinholes, or splay. 11 Annular Ring Acceptance Criteria Acceptable - Class 2 • 90° breakout or less (See item A

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_07_21_10.pdf