Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Wed Apr 21 19:32:13 EDT 2021 | davef
Here's some information about Fred Dimock's work on vacuum reflow - Operation of a Vacuum Reflow Oven with Void Reduction Data [ https://smtnet.com/library/index.cfm?fuseaction=view_article&article_id=3336&company_id=40492 ]
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
Electronics Forum | Fri Feb 01 19:07:57 EST 2013 | hegemon
We have had some success in void reduction with LGA by pre-tinning or "bumping" the devices before placement. The extra solder seems to allow a slightly higher standoff, and allows better outgassing, is my guess. A lot more labor , but the results
Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW
What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and
Electronics Forum | Mon May 27 04:40:21 EDT 2019 | SMTA-Rogers
Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Wed Mar 15 11:43:45 EDT 2017 | rob
Hi PZ, What, sort of like this one? http://creativeelectron.com/papers/EconomicsofLEDVoiding.pdf It even has the handy calculation for the reduction in thermal performance with voiding.
Electronics Forum | Fri Mar 17 21:38:55 EDT 2017 | jlawson
I think the main driver is MTBF data driven by the Car OEMS, mainly german makers pushing this onto suppliers in supply chain. Vacuum soldering and void reduction is a hot topic for the leading electronics suppliers in Germany at the moment. Is not r
