Electronics Forum | Tue Sep 22 09:59:15 EDT 1998 | Mike C
| Hi Jacqueline! | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | If that is true, are there many vias concentrated
Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond
I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of
Electronics Forum | Thu Aug 15 15:58:12 EDT 2002 | robertnguyen
To whom this may concern, I recently ran into the problem with vias on pads of BGA when place BGA and reflow gas trap on vias escape and result in ball having void greater than 50% of BGA diameter. The BGA pad is measured at 20 mils and the vias mea
Electronics Forum | Fri Mar 02 12:23:57 EST 2001 | kerryn
I recommend that you checkout the OnBoard Forum on Stencil Cleaning. You have to enter it via the SMTnet Home Page. I tried going through the OnBoard Forum link and could not see the data. Must be a software glitch. However, there is more informatio
Electronics Forum | Thu Jul 05 06:36:14 EDT 2001 | nifhail
Thanx Dave, I agree with you on the planning part...yapp!! the same guy who've thrown an old datecode components to me..now they did it again on the PCB. Well Dave, could you explain a little bit more about the "hi-test flux" that you mentioned ab
Electronics Forum | Thu Jul 05 06:38:35 EDT 2001 | Danial
Thanx Dave, I agree with you on the planning part...yapp!! the same guy who've thrown an old datecode components to me..now they did it again on the PCB. Well Dave, could you explain a little bit more about the "hi-test flux" that you mentioned ab
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Mon Oct 27 05:35:33 EDT 2014 | grahamcooper22
Are you doing PIN IN PASTE (intrusive reflow) ? If so, then paste can be dripping through the pcb holes and onto the oven bottom heaters / baffles . Or, if any of the SMT pads have vias in them, paste may drip through them if they are not sealed. Whe
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
