Electronics Forum | Fri Apr 17 07:45:43 EDT 1998 | Robert Meston
We have to mount our SMD devices 0.1 to 0.4 mm off the pcb PCb substrate to compensate for thermal stressing in a Space enviroment. Has any one any ideas or contacts for dissolvable pads. this only applies to leadless components
Electronics Forum | Wed Mar 25 14:05:18 EST 1998 | Justin Medernach
| We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in
Electronics Forum | Tue Aug 14 15:44:04 EDT 2001 | davef
Check the fine SMTnet Archives for contacts at ASI and Conductive Circuits. They print materials on substrates to incorporate ECO, not sure about making the trace cuts, though.
Electronics Forum | Wed Aug 22 14:24:39 EDT 2001 | markhoch
I used a CamAlot 5000 to apply conductive epoxy on an aluminum substrate about 4 years ago. I used the largest diameter nozzle CamAlot had, and I bumped the dispense and dwell times way up. It was the slowest stage in the process, but it worked out o
Electronics Forum | Sat Aug 25 13:24:37 EDT 2001 | btaylor
We have used scribed ceramic from CoorsTek for many years with no problem. You will have to control your scribe depth so not to break it during processing. If you have any more question you can e-mail me.
Electronics Forum | Mon Apr 29 05:28:55 EDT 2002 | ianchan
Hi, does that rosy cheeked sales vendor of yours, have a website I can review? do they have online info of that IMPCB? if not, any email contact I can inquiry with? just curious on that IMPCB... Thanks.
Electronics Forum | Mon Apr 29 16:56:13 EDT 2002 | gsmguru
Look at: http://www.bergquistcompany.com/therm.htm The material is made by Bergquist Inc. All sorts of good stuff on their website. Look under Thermal Clad. Dave G
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Mon Oct 14 11:02:57 EDT 2002 | pjc
Can someone please point me to some good technical papers on the Ag Epoxy process covering- printing, dispensing, component placement and curing and on flexible & ridgid substrates too? Are there lots of you out there doing this process? Thx.
Electronics Forum | Thu Oct 31 12:40:44 EST 2002 | cbarnett
I have a production line that is running ceramic substrate's. The line begins having tombstone's when the outside temperature begins to drop. I have moved our nitrogen tanks to the inside of the building and this done nothing. Does anyone have any id
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