Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez
Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone
Electronics Forum | Wed Nov 18 18:10:16 EST 1998 | fraser
| | | | | | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | | | | | | | | | Fraser- | | | | | | | | | | We use polyimide stencils with great success for our prototype boards.
Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan
The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti
Electronics Forum | Tue Oct 15 19:27:08 EDT 2013 | swag
See if you can get a sample of Dek's Nano Protek. We use it on all our fine pitch stencils. I'd say it's kind of like car wax for the aperture walls. They operators really like it a bug me every day to order more if we run out.
Electronics Forum | Tue Jul 31 07:56:43 EDT 2018 | markme
A question for those that carry out SPI. How do you program? Do you take CAD data for the card which will provide a 1-1 pad outline or do you use the stencil data for the program is the actual tool used to determine the paste volume (Aperture reduct
Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Thu Feb 10 09:30:32 EST 2005 | cyber_wolf
I am curious as to why you are using Koki ? Why are you not using a main stream paste that is proven in the industry? Indium,Kester,Multicore,AIM.... It has been my experience that when you start having paste-releasing problems out of the blue, it
Electronics Forum | Thu Mar 23 10:02:09 EST 2006 | Joe
Check placement pressure. I agree with the "smushing" theory. If you can place the component with less pressure, I'd do that first. A switch to Type three paste is also a good idea, as long as your minimum aperture dimension remains at 0.009" as you
Electronics Forum | Thu Nov 12 20:57:04 EST 1998 | Dave F
| | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | Fraser- | | We use polyimide stencils with great success for our prototype boards. They are cheaper and the accuracy/aper
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
