Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Fri May 16 11:19:23 EDT 2003 | blnorman
In addition to the information provided above, we put a bar code label on each of our PCB's, and on 4 lines we burn in the bar code with a laser. That way we have traceability on that board throughout our process. At the end of the line another bar
Electronics Forum | Mon Jul 08 16:03:06 EDT 2019 | slthomas
My recollection is that there is a carrier clip locator that positions (centers) the clip in front of the CTA. Has the adjustment on that been confirmed as well? (Edited because some of it's coming back to me!): I think there is a diamond shaped pin
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Wed Apr 28 14:32:36 EDT 1999 | JohnW
| | | Thank for the input. But I guess I was looking for more. We have been transferring boards for some time and a have good working relationship with our primary CEM and have worked out many bugs. I was thinking more on the order and don't shoot
Electronics Forum | Mon Oct 30 16:00:30 EST 2000 | Finepitch Services
Sal, I kind of assume you have paste there to start with... Because sometimes the edge components do not have paste applied caused by the bottom support in the screen printer etc. And if that is the case for one direction, the other direction applie
Electronics Forum | Wed Jan 14 14:36:29 EST 1998 | Mike Cox
Your questions would require volumes of information to answer completely. This is a readers digest version to help you get started volumes Don't rely on inspection as a process indicator of your quality and defect levels. Unfortunately Inspectio
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
