Electronics Forum | Wed Apr 18 09:16:51 EDT 2007 | Cecil
We currently have an assembly that we have to mask the surface of several (24)SMT components where thermal compound is applied at a latter operation. These component packages vary from BGA's to QFP's. After the thermal compound is applied the PWA is
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Thu Apr 06 13:33:10 EDT 2006 | marla
Hello Dougs: Have you tried stenciling solder paste to the BGA part itself. You will find this most helpful for your heat transfer and attachment integrity of the component in a Pb free process.
Electronics Forum | Fri Nov 12 17:06:07 EST 2010 | dwong
I would also be concerned about spreading solder paste on the walls/floor/equipment downstream of the air. This would then get transfered to hands, clothing and shoes. In turn, tracked out to the rest of the floor/building or even to the home of em
Electronics Forum | Fri Oct 18 09:27:53 EDT 2013 | dontfeedphils
I believe it's mostly worn off through cleaning solvents and the slight abrasion during the under stencil cleaning process. I couldn't say whether or not it's ever in a state that would allow it to transfer to the PCB though.
Electronics Forum | Fri Jul 20 18:07:16 EDT 2001 | mparker
The latent contamination in sponges seems to be a minimal concern to me. Sponges will harbor more bacteria than a wet rag that is washable, but that is of greater concern in the kitchen than the rework line. Keeping a properly tinned solder tip is m
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Tue Jan 13 08:08:37 EST 1998 | Vanessa Munoz
I have recently been put in charge of our SMT line. We have to developed a SPC. My questions are: q1. What are the �most� important parameters to monitoring and which of the control charts do you usually use depending of the parameter..? Our line is
Electronics Forum | Fri Jul 28 09:12:59 EDT 2006 | pavel_murtishev
Good afternoon, Profile is standard ramp-soak-spike (According to paste manufacturer requirements), paste is Almit V16L HM1-RMA, type 3, Sn62Ag2. Look here for details: http://www.yousendit.com/transfer.php?action=download&ufid=98684D1201B0F001
Electronics Forum | Mon Sep 17 17:09:32 EDT 2001 | jschake
Flux: No-clean pastes tend to have a wider print process window in terms of print speed and pressure. More importantly, no-clean pastes are more tolerant to changes in temperature and humidity. They also exhibit longer stencil life than water-solub
