Electronics Forum: paste transfer (Page 5 of 14)

solder balls

Electronics Forum | Wed May 12 07:53:28 EDT 2004 | solderpro

Lets make it easy on the poor guy, some are correct, check you profile but remember one thing most do not apply, it is important to match the type of paste you are using with the style of oven and configuration. send a direct email and I will give so

Re: Profiling

Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey

| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |

Re: Profiling

Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones

| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e

Hot Bar Soldering

Electronics Forum | Wed Jan 07 02:08:56 EST 2009 | sachu_70

Hi! Just joined the circuit. Hot Bar soldering is very reliable provided the Flexible Printed Circuit (FPC) and Rigid PCB design support this technique. Some of the critical aspects that need to be considered include Stencil apperture design for sold

Problems with .45 mil ball diameter BGA....

Electronics Forum | Tue Apr 26 16:00:08 EDT 2005 | jdumont

Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter

Solder Beads

Electronics Forum | Wed Aug 15 13:40:55 EDT 2001 | rkevin

Just as there are a number of causes of solder balling there are also several factors which can lead to or encourage the formation of solder beads. - During the placement of the component solder paste may be squeezed out from underneath the compone

Soldermask Defined BGA Pads

Electronics Forum | Fri Oct 15 08:01:05 EDT 2004 | jmedernach

Hi Matt, You've got an interesting problem. Sounds like something from an X-Files episode but it's still interesting. In your posting, you say that the paste is "there" after screen printing. Release isn't the greatest with a 0.012" round aperture

Re: Electropolishing Laser-Cut Stencils

Electronics Forum | Fri Jul 10 13:16:27 EDT 1998 | Bill Schreiber

To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating capibil

Re: Electropolishing Laser-Cut Stencils

Electronics Forum | Mon Jul 20 23:40:31 EDT 1998 | Alex Ondi

| To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. | I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating cap

01005 Qualifications - Lead Free

Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem

Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia


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