Electronics Forum | Fri Dec 15 14:42:35 EST 2006 | russ
we have has to alter some footprints to facilitate component rework/removal. We have some assemlies that have 2 oz and heavier copper, these boards require a lrger tip to melt solder so we have had to extend pads to allow the larger tips to touch pa
Electronics Forum | Tue Feb 03 03:35:30 EST 2009 | sachu_70
Hi Jose, such a process is possible, but you need to confirm that the PCB material has high Tg. In additon, you need to re-look solder paste printing parameters and make required changes in stencil apperture design for optimum solder volume. Just a
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