Electronics Forum | Tue Oct 23 09:09:27 EDT 2001 | Cemal Basaran
What is the reflow temperature you use to attach this package to your PCB.? I did extensive study on this package and compared it with other packages. I used our own Moire Interferometry, SEM, EDX studies. In my opinion the problem is TI does not man
Electronics Forum | Thu Nov 01 17:40:52 EST 2001 | davef
Listen to Wolfgang. Your dull solder connection is a process indicator. Some 63Sn / Au solder connections look grainy, depending on how your process them and the materials involved. Gold dissolving in tin forms an intermetallic compound [AuSn4] th
Electronics Forum | Fri Feb 15 08:33:59 EST 2002 | fmonette
The joint IPC/JEDEC standard currently specifies a limit of one bake cycle, regardless of the temprature or duration. In the proposed revision this will be replaced by a maximum cumulative duration of 48 hours at 125C. The reason identified for thi
Electronics Forum | Fri Apr 19 15:48:28 EDT 2002 | davef
I don�t know much about zinc either. I can tell you that zinc forms no intermetallics with lead. So, I�m not so sure that �diffusion� is the correct term. Of the following: * Hwang "Modern Solder Technology For � * Wassink "Soldering In Electronic
Electronics Forum | Wed May 15 10:55:35 EDT 2002 | geoff_goring
As I thought..... This is probably why most journals and standards I have studied hold shy of even attempting to predict shelf life. They certainly hold off of any predictions when based on accelerated life testing too. The component lead is a cop
Electronics Forum | Thu Oct 17 12:58:15 EDT 2002 | babe
I agree with everything stated thus far. However, what soldering iron are you using. You may be able to solder the pin with an iron that delivers continuous heat and if there is room utilize a large tip as a heat reservoir. What happens is that the i
Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Electronics Forum | Sun Apr 04 14:59:38 EDT 2004 | davef
When you say, "you can see the plating of each lead embedded in the broken solder joint", we do not get the sense of a well soldered connection. * We don't expect to see [or make the distinction] of the plating from the connector in the solder. We
Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
